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Mitsubishi NZ2GFCE3-32DT CC-Link IE Field Network Module

Mitsubishi NZ2GFCE3-32DT CC-Link IE Field Network Module

Mitsubishi NZ2GFCE3-32DT CC-Link IE Field Network Module

  • Item NO.:

    NZ2GFCE3-32DT
  • Payment:

    T/T
  • Price:

    $650
  • Product Origin:

    USA
  • Color:

    NEW
  • Product weight:

    0.455KG
  • Lead Time:

    In stock

We will arrange delivery within 3-5 days after receiving the payment.

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  • Mitsubishi NZ2GFCE3-32DT | CC‑Link IE Field Network Remote I/O Module

    Manufacturer: Mitsubishi Electric
     
    Model: NZ2GFCE3-32DT
     
    Type: Block‑type remote combined I/O module (CC‑Link IE Field)
     
    Series: NZ2GFCE3 (e‑CON connector, sink logic)
     
    Protocol: CC‑Link IE Field (10 Mbps)
     
    Mounting: DIN rail (cabinet installation)
    image
     

    Specifications

    • I/O Configuration: 16 × DC input (DI) + 16 × transistor output (DO) = 32 points total
    • Input: 24 V DC, positive common (+COM), sink; 4 mA typical per point
    • Output: 24 V DC, sink transistor; max 0.5 A per point
    • Power Supply: 24 V DC (20.4–28.8 V); consumption ≤ 180 mA
    • Communication: CC‑Link IE Field, 1 station occupied
    • Isolation: Photocoupler isolated (input & output)
    • Wiring: e‑CON quick connectors (field‑wirable)
    • Dimensions: 194 × 50 × 68 mm; weight ~0.3 kg
    • Operating Temp: –10 °C to +55 °C; storage –25 °C to +75 °C
    • Certifications: CE, UL, cUL, RCM; conforms to IEC 61131‑2

    Key Features

    1. Compact 32‑Point I/O: 16DI + 16DO in a slim block design, saves cabinet space.
    2. e‑CON Quick Connection: Tool‑less wiring, reduces installation time and errors.
    3. High‑Speed CC‑Link IE: 10 Mbps communication for fast, deterministic I/O control.
    4. Sink Logic (NPN): Common +24 V input/output, widely compatible with sensors/actuators.
    5. Industrial Hardened: Shock/vibration resistant (147 m/s²), suitable for factory floor environments.

    Applications

    • Factory automation, assembly lines, material handling
    • Packaging machinery, machine tools, robotics
    • Distributed I/O systems with CC‑Link IE Field networks
    • General‑purpose digital sensing and actuation

The structure and details of the product:

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