Bachmann BS209 Backplane Module
1. Product Description
An advanced industrial backplane module tailored for high-density integration of Bachmann automation system components. As a key interconnection hub, the BS209 enables efficient signal transmission, stable power distribution, and seamless collaboration between multiple modules (e.g., MP226E processor, AI0288 analog input, and digital I/O modules). It features an optimized slot design, enhanced anti-interference performance, and compatibility with expanded module types, making it ideal for medium-to-large-scale industrial automation systems requiring reliable and scalable interconnection in harsh operating environments.
2. Detailed Specifications
2.1 Slot Configuration
- Number of Slots: 9 standard slots (compatible with Bachmann 32-bit industrial modules)
- Slot Compatibility: Supports processor modules, analog/digital I/O modules, communication modules, and specialty function modules (e.g., motion control modules)
- Slot Spacing: 15 mm per slot (compliant with EN 50022 DIN rail standard)
- Slot Isolation: 500 V DC isolation between adjacent slots (reduces cross-interference)
2.2 Power Distribution
- Input Voltage: 24 V DC ±20% (dual redundant power inputs for high reliability)
- Power Output to Modules: 24 V DC (stable output per slot; 1 A maximum current per slot)
- Power Consumption: Typical 2.5 W (excluding connected modules), Maximum 4 W
- Power Protection: Overcurrent, overvoltage, short-circuit, and reverse polarity protection (per-slot + centralized dual protection)
2.3 Signal Transmission
- Signal Bus Type: High-speed parallel data bus + optional Ethernet backplane bus (dual-bus design)
- Maximum Signal Transmission Rate: Up to 200 Mbps (parallel bus); 1 Gbps (Ethernet bus, if enabled)
- Signal Isolation: 3 kV AC isolation between signal lines and power lines
- Bus Protocol Support: Bachmann proprietary protocol, Modbus TCP/RTU, Profinet, Ethernet/IP, and MQTT
2.4 Operating Environment
- Operating Temperature: -40°C ~ +75°C (wider range than standard models)
- Storage Temperature: -40°C ~ +85°C
- Relative Humidity: 5% ~ 95% (non-condensing)
- Vibration Resistance: 10-500 Hz, 3 g acceleration (compliant with IEC 60068-2-6)
- Shock Resistance: 50 g acceleration, 11 ms duration (compliant with IEC 60068-2-27)
- EMC Compliance: EN 61000-6-2 (industrial immunity), EN 61000-6-4 (industrial emissions)
2.5 Physical Dimensions
- Size: 245×80×30 mm (Length×Width×Height)
- Mounting Type: DIN rail mounting (EN 50022 standard)
- Weight: Approximately 300 g
- Material: Flame-retardant ABS plastic (UL94 V-0 rating); reinforced housing for impact resistance
2.6 Mechanical & Electrical Features
- Module Locking: Metal snap-lock mechanisms (more durable than plastic; prevents vibration-induced loosening)
- Connection Type: Gold-plated pin connectors (low contact resistance; ≥15,000 insertion/extraction cycles)
- LED Indicators: 2 power indicators (green/red, for dual input status), 9 slot status indicators (green/red, for module connection/error status), and 1 bus status indicator (yellow)
3. Advantages & Features
- Expanded Slot Capacity: 9 slots support larger system configurations, reducing the need for multiple backplanes.
- Redundant Power Input: Dual 24 V DC inputs enhance system reliability, avoiding downtime from single power failure.
- High-Speed Dual-Bus: Parallel + Ethernet bus options meet high-bandwidth data transmission needs for complex systems.
- Enhanced Environmental Adaptability: Wider operating temperature range (-40°C ~ +75°C) and higher vibration resistance (3 g) suit extreme industrial sites.
- Intuitive Status Monitoring: Multi-color LED indicators for power, slots, and bus simplify fault diagnosis and maintenance.
4. Application Fields
- Medium-to-Large Industrial Automation: Integrated control systems for automotive assembly lines, heavy machinery, and multi-station production facilities.
- Process Control for Complex Plants: Chemical refineries, oil & gas processing plants, and pharmaceutical production lines requiring multiple I/O and control modules.
- Smart Factory Integration: Connects IoT gateways, edge computing modules, and production management systems for end-to-end data flow.
- Critical Infrastructure Control: Power substations, water treatment plants, and pipeline monitoring systems (relying on redundant power and high reliability).
- Motion Control Systems: Integrated with Bachmann motion control modules for robotic arms, conveyor synchronization, and precision manufacturing.
5. Precautions
- Installation: Use EN 50022-compliant DIN rails; ensure 70 mm clearance on both sides for heat dissipation; avoid corrosive gas, oil, or direct water exposure.
- Power Connection: Connect both redundant power inputs (preferably from separate power supplies); verify polarity before power-on to prevent damage.
- Module Handling: Power off the backplane before installing/removing modules; align connectors carefully (do not force insertion) to protect pins.
- Maintenance: Inspect connectors quarterly (clean with dry air if dusty); replace damaged snap-locks immediately; do not disassemble the backplane (voids warranty).
- EMI Mitigation: Use shielded cables for external connections; maintain a 30 cm distance from high-voltage cables or inverters; ground the backplane housing properly.
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- The structure and details of the product：
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