ABB NGDR-03C Gate Driver Board

• Driven Objects: Adaptable to 600V-1700V IGBT modules, supporting maximum collector current 300A (continuous), 600A (peak).​

• Input Signals: Receives 0-5V TTL level control signals with signal delay ≤500ns, ensuring fast response to control commands.​

• Output Driving Signals: Output peak current ±15A, driving voltage +15V/-10V (gate voltage), pulse width adjustable range 10μs-1ms.​

• Isolation Performance: Electrical isolation between control side and power side, isolation voltage ≥4kVrms (1 minute), adopting magnetic isolation technology with strong anti-electromagnetic interference capability.​

• Protection Functions: Equipped with overcurrent protection (response time ≤1μs), short-circuit protection, overheating protection (triggered when junction temperature ≥175℃) and undervoltage lockout function; outputs fault signal through optocoupler after protection action.​

• Operating Environment: Operating temperature -40℃~85℃, storage temperature -55℃~125℃, relative humidity 5%-95% (non-condensing).​

• Power Requirements: Auxiliary power supply +20V±5%, power consumption ≤10W (without driving load).​

• Dimensions: Length×width×height approximately 120mm×80mm×30mm, installed with bolts, with heat dissipation substrate.​

• Certification Standards: Certified by UL 1557, CE, compliant with IEC 60664-1 insulation standard.​

• High-precision Driving Control: Stable output current and voltage with minimal pulse delay, enabling precise control of switching timing of power devices, reducing switching losses and improving converter efficiency.​

• Multi-level Safety Protection: Fast-response overcurrent and short-circuit protection mechanisms, combined with overheating and undervoltage lockout functions, comprehensively protect power devices from damage and improve system reliability.​

• Strong Isolation and Anti-interference: High isolation voltage and magnetic isolation technology effectively block high-voltage interference from the power side to the control side, ensuring stable signal transmission in high electromagnetic environments.​

• Wide Temperature Adaptability: Operating temperature range of -40℃~85℃, adaptable to temperature fluctuations in harsh working conditions such as new energy vehicles and industrial frequency converters, ensuring stable driving performance.​

• Compact Integrated Design: Miniaturized size with heat dissipation substrate, facilitating compact installation near power modules, reducing wiring length and minimizing the impact of parasitic inductance.​

• Industrial Frequency Converters: Drives IGBT modules in frequency converters to control motor speed, suitable for variable frequency speed regulation systems of fans, pumps, conveyors and other equipment.​

• New Energy Power Generation Systems: In photovoltaic inverters and wind power converters, drives power devices to achieve efficient conversion between DC and AC, ensuring the quality of grid-connected electrical energy.​

• Electric Vehicle Power Systems: Adapts to IGBTs in on-board chargers and motor controllers, precisely controls power conversion, and improves vehicle dynamic performance and endurance.​

• Uninterruptible Power Supply (UPS): Used in the inverter 环节 of UPS, drives power semiconductor devices to switch quickly, ensuring seamless switching to backup power when mains power is interrupted.​

• Power Electronic Equipment: In active power filters and static var generators (SVG), serves as the core driving unit to realize compensation of grid harmonics and reactive power.​

• During installation, ensure the heat dissipation substrate is tightly attached to the heat sink, and apply thermal grease to reduce thermal resistance, preventing damage to the driver board due to overheating.​

• Before wiring, must confirm the auxiliary power supply voltage and polarity to avoid burning the internal circuit due to reverse connection; control signal cables must use shielded wires, with the shield layer grounded at one end.​

• Power side and control side wiring must be strictly separated to avoid interference from power lines to control signal lines; the connecting cables between the driver board and power module should be as short as possible to reduce parasitic parameters.​

• Before first power-on, check whether the protection threshold parameters (such as overcurrent setting value) match the power device to prevent abnormal protection actions.​

• When stored for a long time, it should be placed in a dry environment (humidity ≤60%) to avoid pin oxidation; static electricity on the human body must be discharged before installation to prevent electrostatic breakdown of sensitive components.
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• The structure and details of the product： ​
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